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Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. HoVolume:
49
Year:
2009
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2009.01.006
File:
PDF, 957 KB
english, 2009