Microstructure evolution observation for SAC solder joint:...

Microelectronics Reliability 2009 Vol. 49; Iss. 9-11

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

M. Berthou, P. Retailleau, H. Frémont, A. Guédon-Gracia, C. Jéphos-Davennel
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Volume:
49
Year:
2009
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2009.07.040
File:
PDF, 1.25 MB
english, 2009
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