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Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution
H. Xu, C. Liu, V.V. Silberschmidt, Z. Chen, J. Wei, M. SivakumarVolume:
51
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2010.03.016
File:
PDF, 1.13 MB
english, 2011