Effect of bonding duration and substrate temperature in...

Microelectronics Reliability 2011 Vol. 51; Iss. 1

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution

H. Xu, C. Liu, V.V. Silberschmidt, Z. Chen, J. Wei, M. Sivakumar
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Volume:
51
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2010.03.016
File:
PDF, 1.13 MB
english, 2011
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