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Dynamic flow measurements of capillary underfill through a bump array in flip chip package
Seok Hwan Lee, Jaeyong Sung, Sarah Eunkyung KimVolume:
50
Year:
2010
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2010.07.001
File:
PDF, 974 KB
english, 2010