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R-curve behavior of Cu–Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure
Siva P.V. Nadimpalli, Jan K. SpeltVolume:
527
Year:
2010
Language:
english
Pages:
11
DOI:
10.1016/j.msea.2009.08.046
File:
PDF, 2.23 MB
english, 2010