High-throughput characterization of mechanical properties of Ti–Ni–Cu shape memory thin films at elevated temperature
R. Zarnetta, S. Kneip, Ch. Somsen, A. LudwigVolume:
528
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.msea.2011.05.006
File:
PDF, 1.05 MB
english, 2011