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Wetting characteristics of Sn–Ag–Cu solder on Pd-based metallic glass
Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Mikio Fukuhara, Takeshi Wada, Akihisa InoueVolume:
148
Year:
2008
Language:
english
Pages:
4
DOI:
10.1016/j.mseb.2007.09.069
File:
PDF, 701 KB
english, 2008