Low-temperature wafer-level packaging of a MEMS...

Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition

L. Mele, B. Morana, C. de Boer, J.F. Creemer, P.M. Sarro
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Volume:
1
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.proche.2009.07.382
File:
PDF, 228 KB
english, 2009
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