A flip–chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications
Hrishikesh V. Panchawagh, Faheem F. Faheem, Cari F. Herrmann, David B. Serrell, Dudley S. Finch, Roop L. MahajanVolume:
134
Year:
2007
Language:
english
Pages:
9
DOI:
10.1016/j.sna.2006.05.013
File:
PDF, 1.18 MB
english, 2007