Interconnecting fluidic packages and interfaces for...

Interconnecting fluidic packages and interfaces for micromachined sensors

Michael Pepper, Naveenkumar S. Palsandram, Peng Zhang, Moosung Lee, Hyoung J. Cho
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Volume:
134
Year:
2007
Language:
english
Pages:
8
DOI:
10.1016/j.sna.2006.06.028
File:
PDF, 1.63 MB
english, 2007
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