RF–MEMS wafer-level packaging using through-wafer...

Sensors and Actuators A: Physical 2008 Vol. 142; Iss. 1

RF–MEMS wafer-level packaging using through-wafer interconnect

J. Tian, S. Sosin, J. Iannacci, R. Gaddi, M. Bartek
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Volume:
142
Year:
2008
Language:
english
Pages:
10
DOI:
10.1016/j.sna.2007.09.004
File:
PDF, 1.64 MB
english, 2008
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