Silicon nanopillars based 3D stacked microchannel heat...

Sensors and Actuators A: Physical 2008 Vol. 141; Iss. 2

Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Pradeep Dixit, Nay Lin, Jianmin Miao, Wai Kwan Wong, Teo Kiat Choon
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Volume:
141
Year:
2008
Language:
english
Pages:
10
DOI:
10.1016/j.sna.2007.09.006
File:
PDF, 1.42 MB
english, 2008
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