Low temperature epoxy bonding for wafer level MEMS packaging
Yong-Kook Kim, Eun-Kyung Kim, Soo-Won Kim, Byeong-Kwon JuVolume:
143
Year:
2008
Language:
english
Pages:
6
DOI:
10.1016/j.sna.2007.10.048
File:
PDF, 805 KB
english, 2008