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Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs
Frank Niklaus, Adit Decharat, Fredrik Forsberg, Niclas Roxhed, Martin Lapisa, Michael Populin, Fabian Zimmer, Jörn Lemm, Göran StemmeVolume:
154
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.sna.2009.07.009
File:
PDF, 894 KB
english, 2009