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Distribution of polishing times for a wafer with different patterned polishing pads during CMP and CCMP
Zone-Ching Lin, Chein-Chung ChenVolume:
204
Year:
2010
Language:
english
Pages:
7
DOI:
10.1016/j.surfcoat.2010.01.051
File:
PDF, 638 KB
english, 2010