Characterization of copper layers grown by electrochemical...

Thin Solid Films 2005 Vol. 478; Iss. 1-2

Characterization of copper layers grown by electrochemical mechanical deposition technique

Tony Wang, Paul Lindquist, Serkan Erdemli, Erol C. Basol, Richard Zhang, Cyprian E. Uzoh, Bulent M. Basol
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Volume:
478
Year:
2005
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2004.11.109
File:
PDF, 612 KB
english, 2005
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