Effect of Ni–P thickness on solid-state interfacial...

Thin Solid Films 2006 Vol. 504; Iss. 1-2

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

Aditya Kumar, Zhong Chen, S.G. Mhaisalkar, C.C. Wong, Poi Siong Teo, Vaidhyanathan Kripesh
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Volume:
504
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2005.09.059
File:
PDF, 804 KB
english, 2006
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