Fluxless flip chip bonding with joint-in-via architecture

Thin Solid Films 2006 Vol. 504; Iss. 1-2

Fluxless flip chip bonding with joint-in-via architecture

Teck Kheng Lee, Sam Zhang, C.C. Wong, A.C. Tan
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Volume:
504
Year:
2006
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2005.09.111
File:
PDF, 600 KB
english, 2006
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