Electromigration Cu mass flow in Cu interconnections

Thin Solid Films 2006 Vol. 504; Iss. 1-2

Electromigration Cu mass flow in Cu interconnections

C.-K. Hu, D. Canaperi, S.T. Chen, L.M. Gignac, S. Kaldor, M. Krishnan, S.G. Malhotra, E. Liniger, J.R. Lloyd, D.L. Rath, D. Restaino, R. Rosenberg, J. Rubino, S.-C. Seo, A. Simon, S. Smith, W.-T. Tsen
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Volume:
504
Year:
2006
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2005.09.161
File:
PDF, 246 KB
english, 2006
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