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Parametric investigation of laser diode bonding using eutectic AuSn solder
J.W. Ronnie Teo, G.Y. Li, M.S. Ling, Z.F. Wang, X.Q. ShiVolume:
515
Year:
2007
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2006.07.170
File:
PDF, 586 KB
english, 2007