Diffusion barrier properties of AlMoNbSiTaTiVZr...

Thin Solid Films 2008 Vol. 516; Iss. 16

Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon

Ming-Hung Tsai, Jien-Wei Yeh, Jon-Yiew Gan
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Volume:
516
Year:
2008
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2007.07.109
File:
PDF, 251 KB
english, 2008
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