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Interdiffusion and stress development in Cu–Pd thin film diffusion couples
Y. Kuru, M. Wohlschlögel, U. Welzel, E.J. MittemeijerVolume:
516
Year:
2008
Language:
english
Pages:
12
DOI:
10.1016/j.tsf.2008.05.011
File:
PDF, 1.04 MB
english, 2008