Large array of GaAs modulators and detectors flip-chip...

Journal of Crystal Growth 1997 Vol. 175-176; Iss. part-P2

Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal

J.M. Kuo, Y.C. Wang, K.W. Goossen, L.M.F. Chirovsky, S.P. Hui, B.T. Tseng, J. Walker, A.L. Lentine, R.E. Leibenguth, G. Livescu, W.Y. Jan, J.E. Cunningham, L.A. D'Asaro, A. Ron, D. Dahringer, D. Kossi
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Volume:
175-176
Year:
1997
Language:
english
Pages:
6
DOI:
10.1016/s0022-0248(96)01206-7
File:
PDF, 364 KB
english, 1997
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