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Glass-to-glass electrostatic bonding for FED tubeless packaging application
Byeong-Kwon Ju, Woo-Beom Choi, Yun-Hi Lee, Sung-Jae Jung, Nam-Yang Lee, Jeong-In Han, Kyoung-Ik Cho, Myung-Hwan OhVolume:
29
Year:
1998
Language:
english
Pages:
6
DOI:
10.1016/s0026-2692(97)00119-5
File:
PDF, 542 KB
english, 1998