Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages
Pradeep Lall, Kingshuk BanerjiVolume:
40
Year:
2000
Language:
english
Pages:
15
DOI:
10.1016/s0026-2714(00)00035-4
File:
PDF, 926 KB
english, 2000