Die stress drift measurement in IC plastic packages using...

Microelectronics Reliability 2001 Vol. 41; Iss. 5

Die stress drift measurement in IC plastic packages using the piezo-Hall effect

D Manic, J Petr, R.S Popovic
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Volume:
41
Year:
2001
Language:
english
Pages:
5
DOI:
10.1016/s0026-2714(01)00010-5
File:
PDF, 123 KB
english, 2001
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