Electromigration Performance of Multi-level Damascene...

Microelectronics Reliability 2001 Vol. 41; Iss. 9-10

Electromigration Performance of Multi-level Damascene Copper Interconnects

S. Yokogawa, N. Okada, Y. Kakuhara, H. Takizawa
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Volume:
41
Year:
2001
Pages:
8
DOI:
10.1016/s0026-2714(01)00162-7
File:
PDF, 767 KB
2001
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