Fast temperature cycling and electromigration induced thin...

Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling

H.V. Nguyen, C. Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper
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Volume:
42
Year:
2002
Pages:
6
DOI:
10.1016/s0026-2714(02)00161-0
File:
PDF, 1.21 MB
2002
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