The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates
N. Duan, J. Scheer, J. Bielen, M. van KleefVolume:
43
Year:
2003
Language:
english
Pages:
11
DOI:
10.1016/s0026-2714(03)00135-5
File:
PDF, 793 KB
english, 2003