Ultra-high-density interconnection technology of...

Microelectronics Reliability 2003 Vol. 43; Iss. 8

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, Manabu Bonkohara
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Volume:
43
Year:
2003
Language:
english
Pages:
13
DOI:
10.1016/s0026-2714(03)00167-7
File:
PDF, 712 KB
english, 2003
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