Selective bonding and encapsulation for wafer-level vacuum...

Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems

Yi Tao, Ajay P Malshe, William D Brown
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Volume:
44
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(03)00192-6
File:
PDF, 422 KB
english, 2004
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