Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems
Yi Tao, Ajay P Malshe, William D BrownVolume:
44
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(03)00192-6
File:
PDF, 422 KB
english, 2004