Three-dimensional wafer-scale copper chemical–mechanical...

Thin Solid Films 2002 Vol. 414; Iss. 1

Three-dimensional wafer-scale copper chemical–mechanical planarization model

Dipto G. Thakurta, Donald W. Schwendeman, Ronald J. Gutmann, Sadasivan Shankar, Lei Jiang, William N. Gill
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Volume:
414
Year:
2002
Language:
english
Pages:
13
DOI:
10.1016/s0040-6090(02)00329-2
File:
PDF, 687 KB
english, 2002
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