Fracture toughness, adhesion and mechanical properties of...

Thin Solid Films 2003 Vol. 429; Iss. 1-2

Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

Alex A Volinsky, Joseph B Vella, William W Gerberich
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
429
Year:
2003
Language:
english
Pages:
10
DOI:
10.1016/s0040-6090(03)00406-1
File:
PDF, 1.65 MB
english, 2003
Conversion to is in progress
Conversion to is failed