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Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2
R Hübner, M Hecker, N Mattern, V Hoffmann, K Wetzig, Ch Wenger, H.-J Engelmann, Ch Wenzel, E Zschech, J.W BarthaVolume:
437
Year:
2003
Language:
english
Pages:
9
DOI:
10.1016/s0040-6090(03)00664-3
File:
PDF, 1.38 MB
english, 2003