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Tantalum carbide and nitride diffusion barriers for Cu metallisation
T Laurila, K Zeng, J.K Kivilahti, J Molarius, T Riekkinen, I SuniVolume:
60
Year:
2002
Language:
english
Pages:
10
DOI:
10.1016/s0167-9317(01)00582-2
File:
PDF, 723 KB
english, 2002