Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation–chemical–mechanical polishing (STI–CMP) process
Sang-Yong Kim, Yong-Jin SeoVolume:
60
Year:
2002
Language:
english
Pages:
8
DOI:
10.1016/s0167-9317(01)00694-3
File:
PDF, 656 KB
english, 2002