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Development of PECVD WNx ultrathin film as barrier layer for copper metallization
R Ecke, S.E Schulz, M Hecker, T GessnerVolume:
64
Year:
2002
Language:
english
Pages:
8
DOI:
10.1016/s0167-9317(02)00798-0
File:
PDF, 526 KB
english, 2002