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Effect of annealing on the microstructure of ultrathin tungsten nitride diffusion barriers for copper metallization
M Hecker, R Hübner, R Ecke, S Schulz, H.-J Engelmann, H Stegmann, V Hoffmann, N Mattern, T Gessner, E ZschechVolume:
64
Year:
2002
Language:
english
Pages:
9
DOI:
10.1016/s0167-9317(02)00799-2
File:
PDF, 778 KB
english, 2002