Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes
G. Steinlesberger, M. Engelhardt, G. Schindler, W. Steinhögl, A. von Glasow, K. Mosig, E. BertagnolliVolume:
64
Year:
2002
Language:
english
Pages:
8
DOI:
10.1016/s0167-9317(02)00815-8
File:
PDF, 364 KB
english, 2002