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Evaluation of mechanical stresses in silicon substrates due to lead–tin solder bumps via synchrotron X-ray topography and finite element modeling
J. Kanatharana, J.J. Pérez-Camacho, T. Buckley, P.J. McNally, T. Tuomi, A.N. Danilewsky, M. O’Hare, D. Lowney, W. Chen, R. Rantamäki, L. Knuuttila, J. RiikonenVolume:
65
Year:
2003
Language:
english
Pages:
13
DOI:
10.1016/s0167-9317(02)00852-3
File:
PDF, 978 KB
english, 2003