Study of interaction between polyimide and Cu under a high...

Applied Surface Science 2001 Vol. 171; Iss. 1-2

Study of interaction between polyimide and Cu under a high humidity condition

N. Nagai, T. Hironaka, T. Imai, T. Harada, M. Nishimura, R. Mimori, H. Ishida
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Volume:
171
Year:
2001
Language:
english
Pages:
5
DOI:
10.1016/s0169-4332(00)00539-0
File:
PDF, 438 KB
english, 2001
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