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Improved characteristics of electroless Cu deposition on Pt–Ag metallized Al2O3 substrates in microelectronics packaging
C.C. Young, J.G. Duh, C.S. HuangVolume:
145
Year:
2001
Language:
english
Pages:
11
DOI:
10.1016/s0257-8972(01)01270-1
File:
PDF, 1.76 MB
english, 2001