Microstructural evolution during grain boundary engineering...

Acta Materialia 2002 Vol. 50; Iss. 10

Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials

Mukul Kumar, Adam J. Schwartz, Wayne E. King
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Volume:
50
Year:
2002
Language:
english
Pages:
14
DOI:
10.1016/s1359-6454(02)00090-3
File:
PDF, 674 KB
english, 2002
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