Thermally Induced Failure of Copper-Bonded Alumina...

Journal of the American Ceramic Society 1992 Vol. 75; Iss. 12

Thermally Induced Failure of Copper-Bonded Alumina Substrates for Electronic Packaging

Yuichi Yoshino, Hidehiko Ohtsu, Takashi Shibata
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Volume:
75
Year:
1992
Language:
english
Pages:
5
DOI:
10.1111/j.1151-2916.1992.tb04433.x
File:
PDF, 594 KB
english, 1992
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