Volume 30; Issue 9

Journal of Electronic Materials

Volume 30; Issue 9

1

Foreword

Sung K. Kang, Hareesh Mavoori, Srinivas Chada, C. Robert Kao, Ronald W. Smith

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 44 KB

english, 2001

2

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

I. E. Anderson, J. C. Foley, B. A. Cook, J. Harringa, R. L. Terpstra, O. Unal

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 4.36 MB

english, 2001

3

Influence of alloy composition on fillet-lifting phenomenon in Sn-Ag-Bi alloys

H. Takao, H. Hasegawa

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 4.84 MB

english, 2001

4

Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact

Kwang-Lung Lin, Hui-Min Hsu

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.73 MB

english, 2001

5

Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

F. Guo, J. Lee, S. Choi, J. P. Lucas, T. R. Bieler, K. N. Subramanian

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 13.78 MB

english, 2001

6

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

H. G. Song, J. P. Ahn, J. W. Morris

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 2.25 MB

english, 2001

7

Observations of microstructural coarsening in micro flip-chip solder joints

Monica M. Barney, J. W. Morris

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 4.02 MB

english, 2001

8

Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system

X. J. Liu, H. S. Liu, I. Ohnuma, R. Kainuma, K. Ishida, S. Itabashi, K. Kameda, K. Yamaguchi

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.89 MB

english, 2001

9

Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Z. Moser, W. Gasior, J. Pstrus

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 281 KB

english, 2001

10

Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems

Jong Ho Lee, Dong Nyung Lee

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 320 KB

english, 2001

11

Studies of the Ag-In phase diagram and surface tension measurements

Z. Moser, W. Gasior, J. Pstrus, W. Zakulski, I. Ohnuma, X. J. Liu, Y. Inohana, K. Ishida

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.16 MB

english, 2001

12

Morphological stability of solder reaction products in flip chip technology

K. N. Tu, Fiona Ku, T. Y. Lee

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.72 MB

english, 2001

13

Interfacial reactions in the Sn-Ag/Au couples

Sinn-Wen Chen, Yee-Wen Yen

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.01 MB

english, 2001

14

Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface

Jong-Hyun Lee, Jong-Hwan Park, Dong-Hyuk Shin, Yong-Ho Lee, Yong-Seog Kim

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.98 MB

english, 2001

15

Interfacial reactions between a Pb-Free solder and die backside metallizations

G. Ghosh, M. J. Pfeifer

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.35 MB

english, 2001

16

Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

C. M. Liu, C. E. Ho, W. T. Chen, C. R. Kao

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.99 MB

english, 2001

17

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

A. Zribi, A. Clark, L. Zavalij, P. Borgesen, E. J. Cotts

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 4.94 MB

english, 2001

18

Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization

J. Y. Park, C. W. Yang, J. S. Ha, C. -U. Kim, E. J. Kwon, S. B. Jung, C. S. Kang

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 2.52 MB

english, 2001

19

Intermetallic growth of wire-bond at 175°C high temperature aging

Hen-So Chang, J. X. Pon, Ker-Chang Hsieh, C. C. Chen

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 6.78 MB

english, 2001

20

The creep of lead-free solders at elevated temperatures

W. J. Plumbridge, C. R. Gagg, S. Peters

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.23 MB

english, 2001

21

Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach

Yoshiharu Kariya, Tomoo Morihata, Eisaku Hazawa, Masahisa Otsuka

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.48 MB

english, 2001

22

Constitutive and damage model for a lead-free solder

Shengmin Wen, Leon M. Keer, Hareesh Mavoori

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 2.02 MB

english, 2001

23

Stress relaxation behavior of composite and eutectic Sn-Ag solder joints

S. G. Jadhav, T. R. Bieler, K. N. Subramanian, J. P. Lucas

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 692 KB

english, 2001

24

Application of an asymmetrical four point bend shear test to solder joints

Ö. Unal, I. E. Anderson, J. L. Harringa, R. L. Terpstra, B. A. Cook, J. C. Foley

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.20 MB

english, 2001

25

Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

B. A. Cook, I. E. Anderson, J. L. Harringa, R. L. Terpstra, J. C. Foley, Ö. Ünal, F. C. Laabs

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 6.05 MB

english, 2001

26

Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles

F. Guo, J. Lee, J. P. Lucas, K. N. Subramanian, T. R. Bieler

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 5.40 MB

english, 2001

27

Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys

Noboru Wade, Kepeng Wu, Johji Kunii, Seiji Yamada, Kazuya Miyahara

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 2.65 MB

english, 2001

28

The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders

C. M. Chuang, T. S. Lui, L. H. Chen

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 8.22 MB

english, 2001

29

Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3substrate

C. C. Young, J. G. Duh, S. Y. Tsai

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.30 MB

english, 2001

30

Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging

B. Djurfors, D. G. Ivey

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 5.59 MB

english, 2001

31

Laser soldering for chip-on-glass mounting in flat panel display application

Jong-Hyun Lee, Won-Yong Kim, Dong-Hoon Ahn, Yong-Ho Lee, Yong-Seog Kim

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 4.04 MB

english, 2001

32

Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints

P. Snugovsky, P. Arrowsmith, M. Romansky

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 6.41 MB

english, 2001

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