Volume 34; Issue 7

Journal of Electronic Materials

Volume 34; Issue 7
4

Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy

Year:
2005
Language:
english
File:
PDF, 274 KB
english, 2005
16

Lead-free interconnect technique by using variable frequency microwave

Year:
2005
Language:
english
File:
PDF, 813 KB
english, 2005
17

Fabrication and thermal evaluation of silicon on diamond wafers

Year:
2005
Language:
english
File:
PDF, 186 KB
english, 2005