Volume 111; Issue 4

Journal of Electronic Packaging

Volume 111; Issue 4
4

Calculated Interfacial Stresses in Elongated Bimaterial Plates Subjected to Bending

Year:
1989
Language:
english
File:
PDF, 488 KB
english, 1989
8

Solder Fillet Height Criteria for Surface Mounted Chip Components

Year:
1989
Language:
english
File:
PDF, 1.88 MB
english, 1989
11

Combined Moisture and Thermal Stresses Failure Mode in a PLCC

Year:
1989
Language:
english
File:
PDF, 674 KB
english, 1989
12

Finite Element Modeling for Optimizing Hermetic Package Reliability

Year:
1989
Language:
english
File:
PDF, 567 KB
english, 1989