Volume 121; Issue 2

Journal of Electronic Packaging

Volume 121; Issue 2
1

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

Year:
1999
Language:
english
File:
PDF, 869 KB
english, 1999
8

Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components

Year:
1999
Language:
english
File:
PDF, 479 KB
english, 1999
9

Unsteady Wire Sweep Due to Transfer Molding in a 160L QFP Package

Year:
1999
Language:
english
File:
PDF, 1.09 MB
english, 1999