Volume 25; Issue 9

Journal of Materials Research

Volume 25; Issue 9
1

A new paradigm in thin film indentation

Year:
2010
Language:
english
File:
PDF, 930 KB
english, 2010
2

Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints

Year:
2010
Language:
english
File:
PDF, 1.01 MB
english, 2010
5

Synthesis of AlN nanowhiskers

Year:
2010
Language:
english
File:
PDF, 1.09 MB
english, 2010