Volume 389-390

Key Engineering Materials

Volume 389-390

1

Grinding Burn and Chatter Classification Using Genetic Programming

Chen, Xun, Griffin, James

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 310 KB

english, 2009

2

Study on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound Finishing

Zhang, Fei Hu, Wang, Hui Jun, Liu, Jian Feng, Luan, Dian Rong, Zhang, Yong

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 666 KB

english, 2009

3

A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet

Nguyen, Thai, Pang, King, Wang, Jun

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 2.75 MB

english, 2009

4

Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools

Suzuki, Tsunehisa, Mitsui, Toshiaki, Fujino, Tomoki, Kato, Mutsuto, Satake, Yasufumi, Saito, Hiroshi, Kobayashi, Seiya

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 5.57 MB

english, 2009

5

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Huo, Feng Wei, Guo, Dong Ming, Kang, Ren Ke, Jin, Zhu Ji

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 501 KB

english, 2009

6

Development of DLC Coated Tool for Cutting of Aluminum Alloy －Influence of Deposition Condition on Cutting Characteristic－

Minaki, Kazushi, Kitajima, Koichi, Nakahira, Yu, Ohnishi, Masami, Sugimoto, Takashi, Kaminomura, Shun

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 391 KB

english, 2009

7

Model Based Characterization of the Grinding Wheel Effective Topography

Kramer, Niklas, Wangenheim, C.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.11 MB

english, 2009

8

Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad

Tso, Pei Lum, Shih, Cheng Yi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 554 KB

english, 2009

9

Fundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction Flow

Ohashi, Kazuhito, Wang, Rong Jun, Hasegawa, Hiroyuki, Tsukamoto, Shinya

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.80 MB

english, 2009

10

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Sasaki, J., Tsuruga, T., Soltani, B.H., Mitsuta, T., Tian, Y.B., Shimizu, Jun, Zhou, Li Bo, Eda, Hiroshi, Tashiro, Y., Iwase, Hisao, Kamiya, Sumio

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 351 KB

english, 2009

11

Study on Adhesion Removal Model in CMP SiO2 ILD

Guo, Dong Ming, Liu, Rui Hong, Kang, Ren Ke, Jin, Zhu Ji

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 421 KB

english, 2009

12

Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding

Wang, Wan Shan, Zhu, L.D., Yu, Tian Biao, Yang, Jian Yu, Tang, L.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 538 KB

english, 2009

13

Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding

Ichida, Yoshio, Sato, Ryunosuke, Fujimoto, Masakazu, Fredj, Nabil Ben

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 876 KB

english, 2009

14

High Speed Cutting of Titanium Alloy with PCD Tools

Ota, Michiko, Okida, Junya, Harada, Takashi, Toda, Naohiro, Sumiya, Hitoshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 331 KB

english, 2009

15

Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted Grinding

Nomura, Mitsuyoshi, Wu, Yong Bo, Kuriyagawa, Tsunemoto, Kawashima, Takahiro, Shibata, Takayuki

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 425 KB

english, 2009

16

Control of Nano-Topography on an Axisymmetric Ground Surface

Yoshihara, Nobuhito, Yan, Ji Wang, Kuriyagawa, Tsunemoto

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 3.58 MB

english, 2009

17

Evaluation of Bearing Grinding Fluids

Hoff, Milton L., Salmon, Stuart C.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 582 KB

english, 2009

18

Virtual Truing and Dressing of Grinding Wheel

Bzymek, Zbigniew M., Duzy, Glenn M., Mindek, Richard B.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.40 MB

english, 2009

19

Study on Glass Strength at High Speed Edge Rounding for LCD

Suzuki, Nobuyoshi, Halai, Tatsunoli

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 742 KB

english, 2009

20

Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools

Ohta, Tsutomu, Yan, Ji Wang, Kodera, Sunao, Yajima, Shuuma, Horikawa, Naoyuki, Takahashi, Youichi, Kuriyagawa, Tsunemoto

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 351 KB

english, 2009

21

The Research of NC Magnetic Abrasive Finishing for Mould Parting Surface

Gao, Wei Qiang, Meng, L., Yan, Qiu Sheng, Song, J.H., Qiu, T.X.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 336 KB

english, 2009

22

Computer Aided Design and Grinding for Helical Drill Points

Zou, Ping, Li, Xin You, Tang, Y., Yang, X.L.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 438 KB

english, 2009

23

Study on Abrasive Geometry of Quick-Point Grinding

Yuan, Suo Xian, Xie, Dong Na, Gong, Ya Dong

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 362 KB

english, 2009

24

Study on the Subsurface Damage of Single Crystal MgO Substrates

Dong, Zhi Gang, Kang, Ren Ke, Jia, Zhen Yuan

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.38 MB

english, 2009

25

Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding

Huang, Han, Wu, Y.Q., Wang, Y., Zou, Jin, Zhou, Li Bo

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 859 KB

english, 2009

26

Actively Cooled and Activated Coolant for Grinding Brittle Materials

Gao, Y., Xin, J., Lai, H.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 2.68 MB

english, 2009

27

Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond Turning

Zhang, Zhi Yu, Yan, Ji Wang, Kuriyagawa, Tsunemoto

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 2.49 MB

english, 2009

28

Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology

Yu, Tian Biao, Gong, Ya Dong, Li, Hu, Yang, Jian Yu, Wang, Wan Shan

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 667 KB

english, 2009

29

An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil

Tsai, Y.Y., Chang, Chih Kang

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 585 KB

english, 2009

30

Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB

Nojiri, Hiroshi, Hirogaki, Toshiki, Aoyama, Eiichi, Ogawa, Keiji, Otsuka, Tsuyoshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 326 KB

english, 2009

31

Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed Grinder

Wang, Wan Shan, Zhu, L.D., Yu, Tian Biao, Shi, Jia Shun, Li, He

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 527 KB

english, 2009

32

The Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding Wheel

Liu, Feng, Gong, Ya Dong, Shan, Y.Q., Cai, Guang Qi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 524 KB

english, 2009

33

Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring Method

Lee, Hwa Soo, Yamada, Takazo, Ishida, Naoyuki

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 419 KB

english, 2009

34

Study on the CMP Pad Life with its Mechanical Properties

Tso, Pei Lum, Huang, Zhe Hao, Chou, Sheng Wei, Shih, Cheng Yi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 288 KB

english, 2009

35

Achieving a Damage-Free Polishing of Mono-Crystalline Silicon

Biddut, A.Q., Zhang, Liang Chi, Ali, Y.M., Liu, Zong Wen

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 971 KB

english, 2009

36

Hole Machining of Glass by Micro Abrasive Suspension Jets

Wang, Cheng Yong, Chen, M.D., Yang, P.X., Fan, Jing Ming

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 306 KB

english, 2009

37

Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization

Qin, N., Guo, Dong Ming, Kang, Ren Ke, Huo, Feng Wei

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.41 MB

english, 2009

38

Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone

Shi, Z., Srinivasaraghavan, Madhusudhan, Attia, Helmi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 408 KB

english, 2009

39

A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds

Kompella, Sridhar, Zhang, Kai, Pakalapati, Rajeev

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 555 KB

english, 2009

40

Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material -

Okida, Junya, Moriguchi, Hideki, Nishioka, Takao, Yoshimura, Hiromi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 768 KB

english, 2009

41

A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces

Harada, Takeshi, Semba, Takuya

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.02 MB

english, 2009

42

Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

Guo, Dong Ming, Tian, Y.B., Kang, Ren Ke, Zhou, Li Bo, Lei, M.K.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 358 KB

english, 2009

43

Grinding Combination of Electrochemical Smoothing On SKH 51 Surface

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 256 KB

english, 2009

44

Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation

Suehisa, Yumetaka, Aoki, Toshiaki, Shimizu, Jun, Zhou, Li Bo, Eda, Hiroshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 688 KB

english, 2009

45

Researches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding

Xiu, Shi Chao, Yuan, Suo Xian, Cai, Guang Qi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 991 KB

english, 2009

46

Ultrasonic Vibration-Assisted Cutting of Titanium Alloy

Koshimizu, Shigeomi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 909 KB

english, 2009

47

Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron

Harada, Takashi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 337 KB

english, 2009

48

Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool

Harun, Suryadiwansa, Shibasaka, Toshiro, Moriwaki, Toshimichi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.60 MB

english, 2009

49

Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining-

Tateishi, T., Yoshihara, Nobuhito, Yan, Ji Wang, Kuriyagawa, Tsunemoto

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 490 KB

english, 2009

50

A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV

Gong, Ya Dong, Zhang, Yan Cheng, Li, Hu, Wang, Wan Shan

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.15 MB

english, 2009

51

Profit Optimization of Abrasive Blasting Systems

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 352 KB

english, 2009

52

Electrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic Transducer

Iwai, Manabu, Wei, Wen Qiu, Ninomiya, Shinichi, Sano, Sadao, Uematsu, Tetsutaro, Suzuki, Kiyoshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.42 MB

english, 2009

53

Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy

Abe, Yoshinori, Ishikawa, Ken-Ichi, Suwabe, Hitoshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 728 KB

english, 2009

54

Synchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall Surface

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 235 KB

english, 2009

55

Spatial Distribution of Cooling Mist for Precision Grinding

Gao, Y., Xin, J., Lai, H.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 529 KB

english, 2009

56

Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing

Huang, Guo Qin, Huang, Hui, Xu, Xi Peng

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.13 MB

english, 2009

57

Measurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method

Nagaike, Y., Kuriyagawa, Tsunemoto, Gao, Wei, Yan, Ji Wang, Yoshihara, Nobuhito

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.81 MB

english, 2009

58

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool

Tamaki, Junichi, Kubo, Akihiko, Yan, Ji Wang

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 683 KB

english, 2009

59

Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film

Jin, Zhu Ji, Yuan, Ze Wei, Kang, Ren Ke, Dong, B.X.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 859 KB

english, 2009

60

Model-Based Compensation of Geometry-Errors when Grinding Material Compounds

Denkena, Berend, Kramer, Niklas

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 459 KB

english, 2009

61

Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen

Wu, Yong Bo, Shimada, Kunio

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 6.18 MB

english, 2009

62

Design of Double Nozzle Type Powder Jet Device Optimized for PJD

Shibuya, Toshihiko, Sepasy, Mohammad Saeed, Mizutani, Koichi, Yoshihara, Nobuhito, Yan, Ji Wang, Kuriyagawa, Tsunemoto

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 318 KB

english, 2009

63

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

Yuan, H.P., Gao, Hang, Bao, Yong Jie, Wu, Yong Bo

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 448 KB

english, 2009

64

Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model

Yamada, Taisei, Lee, Hwa Soo

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 3.15 MB

english, 2009

65

Experimental Trial of Fullerene Wheel Fabrication

Tanaka, Takeshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 463 KB

english, 2009

66

Development of A New Cutting Fluid Supply System for Near Dry Machining Process

Yamashita, Motoki, Kakinuma, Yasuhiro, Aoyama, Tojiro, Aoki, Mitsuho

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 5.02 MB

english, 2009

67

Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding

Hara, Keisuke, Isobe, Hiromi, Kyusojin, Akira

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 2.29 MB

english, 2009

68

Grinding of Soft Steel with Assistance of Ultrasonic Vibrations

Tawakoli, Taghi, Azarhoushang, Bahman, Rabiey, Mohammad

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 3.32 MB

english, 2009

69

Fuzzy Rules for Surface Roughness of Ground Steels

Ali, Y.M., Zhang, Liang Chi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 272 KB

english, 2009

70

Geometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD Model

Suzuki, Kiyoshi, Shiraishi, Yoichi, Ninomiya, Shinichi, Iwai, Manabu, Uematsu, Tetsutaro

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 698 KB

english, 2009

71

Planing of Cobalt-Free Tungsten Carbide Using a Diamond Tool -Cutting Temperature and Tool Wear-

Yui, Akinori, Matsuoka, Hiroshi, Kitajima, Takayuki, Okuyama, Shigeki

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 482 KB

english, 2009

72

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels

Guo, Jian Qiang, Ohmori, Hitoshi, Katahira, Kazutoshi, Uehara, Yoshihiro

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 3.37 MB

english, 2009

73

A New Type of Drill Grinder Based on the Special Universal Joint

Zou, Ping, Qiu, H.R., Gao, Shan Min, Hu, Ming

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 334 KB

english, 2009

74

A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition

Hwang, Sung Chul, Won, Jong Koo, Lee, Jung Taik, Lee, Eun Sang

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.29 MB

english, 2009

75

Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction

Azusawa, Keisuke, Ishii, Yuta, Shimizu, Jun, Zhou, Li Bo, Eda, Hiroshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 627 KB

english, 2009

76

The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon

Ohashi, Kazuhito, Sumimoto, Y., Fujita, Y., Hasegawa, Hiroyuki, Tsukamoto, Shinya

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.44 MB

english, 2009

77

Numerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding

Hasegawa, Hiroyuki, Suritalatu,, Sakakura, Moriaki, Tsukamoto, Shinya

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 631 KB

english, 2009

78

The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter

Chang, Li, Zhang, Liang Chi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 371 KB

english, 2009

79

Development of a Three-Dimensional Tool Oscillation System for Finishing Metal Molds

Mizuno, Masahiro, Iyama, Toshirou, Zhang, Xu, Nishikawa, Naohiro

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.08 MB

english, 2009

80

Simulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive Finishing

Yan, Qiu Sheng, Qiu, T.X., Gao, Wei Qiang, Meng, L.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 323 KB

english, 2009

81

Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel

Ninomiya, Shinichi, Qiang, Fan, Shimizu, Toshiharu, Iwai, Manabu, Uematsu, Tetsutaro, Suzuki, Kiyoshi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 632 KB

english, 2009

82

Effect of Polishing Time and Pressure on Polishing Pad Performance

Biddut, A.Q., Zhang, Liang Chi, Ali, Y.M.

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.60 MB

english, 2009

83

Scale Effect of Nano-Indentation of Silicon – A Molecular Dynamics Investigation

Mylvaganam, Kausala, Zhang, Liang Chi

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 772 KB

english, 2009

84

Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation

Yan, Ji Wang, Asami, Tooru, Kuriyagawa, Tsunemoto

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 2.10 MB

english, 2009

85

Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

Sato, Ryunosuke, Ichida, Yoshio, Morimoto, Yoshitaka, Shimizu, Kenji

Journal:

Key Engineering Materials

Year:

2009

Language:

english

File:

PDF, 1.84 MB

english, 2009

86

Engineering a Next Generation Water-Based Grinding Fluid

Hug, Peter, Nelson, Andrew R., Salmon, Stuart C.

Journal:

Key Engineering Materials

Year:

2008

File:

PDF, 227 KB

2008

87

Thermal Deformation of Base Sheet and Local Deformation Around Laser Cutting Edge

Nunobiki, Masayuki, Okuda, Koichi, Morino, Shogo

Journal:

Key Engineering Materials

Year:

2008

File:

PDF, 401 KB

2008

88

Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste

Sakamoto, Haruhisa, Nabata, Shogo, Shimizu, Shinji

Journal:

Key Engineering Materials

Year:

2008

File:

PDF, 636 KB

2008